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UltraEM
UltraEM XC
SuperEM
EMCompiler

产品介绍

Product Description

芯片级的电磁仿真专家(UltraEM),采用领先的三维全波电磁仿真技术,用于分析高速和射频/微波集成电路版图的电磁场效应,并与业界领先的模拟芯片设计环境进行无缝整合。UltraEM能够用于创建参数化器件模型,支持与SuperEM一起实现芯片-封装‐PCB自适应精度联合仿真,并且可以和EMCompiler中的原理图仿真结合,实现电磁和电路的协同仿真,为广大的设计人员提供高精度电磁分析服务。

The chip-level electromagnetic design tool (UltraEM) uses the proprietary three-dimensional full-wave electromagnetic engine to analyze the electromagnetic effects of high-speed and RF/microwave integrated circuit layouts. It tightly integrates with the mainstream analog chip design environments in industry. UltraEM can create parameterized EM models, which can be imported into EMCompiler to perform circuit simulations together with designed schematics. The electromagnetic and circuit co-simulations provide high-precision system-level analysis capabilities for the product designers.

功能特性

Feature Highlights

1. 美观易用的用户界面,强大的版图编辑能力。

1. Nice and easy-to-use user interface with strong layout editing capability.

2. 内置参数化单元库。

2. Built-in library of parameterized cells.

3. 高效、准确的三维全波电磁仿真器,用于无源电路建模和分析。

3. The proprietary highly-efficient three-dimensional full-wave EM engine, which is used for modeling and analysis of passive circuits.

4. AI建模技术,可对电路进行参数化设置,快速训练建模,进行快速优化设计。

4. The proprietary AI modelling technique, which is used to train and model the parameterized circuit, and quickly optimize the design.

5. S/Y/Z参数及自定义输出参数。

5. Support S / Y / Z parameters and user-defined parameters for post-processing.

6. 自动生成原理图等效模型,进行电磁电路协同仿真。

6. Automatically generate schematic model for the electromagnetic and circuit co-simulation.

7. 支持局部版图仿真。

7. Support simulation on a selected part of the layout.

8.先进工艺:
  • 可将材料厚度、金属线宽、介电层的物理参数设置为预定义变量,实现各种参数的扫描。
  • 支持Temperature/Corner的设置及扫描。
  • 支持RPSQ参数、Conductivity或Via电阻设定。
  • 支持金属的Width和Spacing变量。
8. Advanced Processes:
  • Material thickness, metal wire width, physical parameters of dielectric layers can be defined as pre-defined variables, which can be used in sweep.
  • Support temperature/corner settings and sweep.
  • Support RPSQ parameter, conductivity, or via resistance settings.
  • Support metal Width and Spacing variables.
  • Support metal surface roughness modeling.
9.联合仿真:
  • 支持工艺叠层功能配置:可以导入多种格式的工艺文件进行合适的叠层配置。
  • 创新的联合电磁仿真算法,实现芯片-封装‐PCB联合仿真。
  • 支持三维模型TSV、BGA等。
  • 支持层级式设计,高效赋能SiP、AiP等多种封装形式。
9. Co-simulation:
  • Support process stacking configuration: Multiple process files can be imported and configured properly.
  • Innovative EM algorithm to realize Chip-Packaging-PCB co-simulation.
  • Support 3D models such as TSV, BGA, etc.
  • Support hierarchical designs, which efficiently facilitates various packaging designs such as SiP, AiP, etc.

UltraEM 可仿真的无源器件模型

Passive device models that can be loaded into UltraEM

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产品介绍

Product Description

易于使用的芯片级电磁设计工具(UltraEM XC),与主流IC布局编辑器无缝集成。

Easy-to-use chip-level electromagnetic design tool, which is seamlessly integrated with mainstream IC layout editor.

功能特性

Feature Highlights

1. 高效、准确的三维全波电磁仿真器,用于无源电路建模和分析。

1. The proprietary highly-efficient three-dimensional full-wave EM engine, which is used for the modeling and analysis of passive circuit.

2. 与主流IC设计软件无缝集成。

2. Integrated seeminglessly with mainstream IC design platforms.

3. S/Y/Z参数及自定义输出参数。

3. Support S / Y / Z parameters and user-defined parameters in post-processing.

4. 自动生成原理图等效模型,进行电磁电路协同仿真。

4. Automatically generate schematic model for the electromagnetic and circuit co-simulation.

5.先进工艺:
  • 可将材料厚度、金属线宽、介电层的物理参数设置为预定义变量,实现各种参数的扫描。
  • 支持Temperature/Corner的设置及扫描。
  • 支持RPSQ参数、Conductivity或Via电阻设定。
  • 支持金属的Width和Spacing变量。
5. Advanced Processes:
  • Material thickness, metal wire width, physical parameters of dielectric layers can be defined as pre-defined variables, which can be used in sweep.
  • Support temperature/corner settings and sweep.
  • Support RPSQ parameter, conductivity, or via resistance settings.
  • Support metal Width and Spacing variables.
  • Support metal surface roughness modeling.
6.联合仿真:
  • 支持工艺叠层功能配置:可以导入多种格式的工艺文件进行合适的叠层配置。
  • 创新的联合电磁仿真算法,实现芯片-封装‐PCB联合仿真。
  • 支持三维模型TSV、BGA等。
  • 支持层级式设计,高效赋能SiP、AiP等多种封装形式。
6. Co-simulation:
  • Support process stacking configuration: Multiple process files can be imported and configured properly.
  • Innovative EM algorithm to realize Chip-Packaging-PCB co-simulation.
  • Support 3D models such as TSV, BGA, etc.
  • Support hierarchical designs, which efficiently facilitates various packaging designs such as SiP, AiP, etc.

联系我们:service@faradynamics.com,免费试用UltraEM XC。

Contact us: service@faradynamics.com, free trial of UltraEM XC.

产品介绍

Product Description

高速印刷电路版电路、微带天线、封装等的电磁仿真专家(SuperEM),领先的三维全波电磁仿真器,主要用于射频和高速电路等的设计领域。

Electromagnetic simulation, modeling and design tool for high-speed PCB circuits, microstrip antennas, packaging and etc.Equiped with a leading three-dimensional full-wave electromagnetic engine, mainly aimed for the design of RF and high-speed circuits.

功能特性

Feature Highlights

1. 高效、准确的三维全波电磁仿真器,用于微带天线,PCB电路,封装等的建模和分析。

1. The proprietary highly-efficient three-dimensional full-wave EM engine, which is used for the modeling and analysis of microstrip patch antennas, PCB circuits, packaging, etc.

2. 内置参数化单元库。

2. Built-in library of parameterized cells.

3. AI建模技术,可对电路进行参数化设置,快速训练建模,进行快速优化设计。

3. The proprietary AI modelling technique, which is used to train and model the parameterized circuit, and quickly optimize the design.

4. 支持含集总元件的版图仿真。

4. Support co-simulation of IC layout and lumped elements.

5. 支持局部版图仿真。

5. Support simulation on a selected part of the layout.

6. 支持S/Y/Z参数, 辐射方向图等输出结果。

6. Support S / Y / Z parameters, radiation patterns and other output results.

7. 可以与专业的PCB设计软件进行集成。

7. Tightly integrated with some mainstream PCB layout editors.

8.联合仿真:
  • 支持工艺叠层功能配置:可以导入多种格式的工艺文件进行合适的叠层配置。
  • 创新的联合电磁仿真算法,实现芯片-封装‐PCB联合仿真。
  • 支持三维模型TSV、BGA等。
  • 支持层级式设计,高效赋能SiP、AiP等多种封装形式。
8. Co-simulation:
  • Support process stacking configuration: Multiple process files can be imported and configured properly.
  • Innovative EM algorithm to realize Chip-Packaging-PCB co-simulation.
  • Support 3D models such as TSV, BGA, etc.
  • Support hierarchical designs, which efficiently facilitates various packaging designs such as SiP, AiP, etc.

SuperEM 可仿真类型

SuperEM Design Examples

微带天线

Microstrip Patch Antenna

PCB电路

PCB Circuit

芯片封装

Chip Package

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产品介绍

Product Description

系统级的电路仿真设计平台,用于大规模射频、微波/毫米波、高速数字电路的系统级仿真以及参数优化等。采用了先进的AI技术,可对电路版图进行快速仿真和参数优化等工作。

EMCompiler is a system-level full-wave electromagnetic design platform for simulation, modeling and design optimization of large-scale RF, microwave, millimeter-wave and high-speed digital circuits. EMCompiler uses the state-of-the-art artificial intelligence (AI) technology to perform fast simulation, modeling, and design optimization by virtue of innovative proprietary AI models.

EMCompiler可以直接调用UltraEM/SuperEM

SuperEM/UltraEM is Invoked by EMCompiler

功能特性

Feature Highlights

1. 创新的AI单元模型库。

1. Innovative Proprietary AI Model Library.

2. 自带的多种集总元器件单元库。

2. Lumped-element Library.

3. 强大的自定义单元模型。

3. User-defined Models.

4. 高效的电路优化功能。

4. Highly Efficient Circuit Optimization.

5. 原理图版图联合仿真
  • EMCompiler可以直接调用UltraEM/SuperEM已计算好的AI模型、Spice等效电路模型、S参数等模型,与有源电路一起实现版图与原理图的场-路联合仿真。
5.Schematic-Layout Co-simulation
  • By virtue of active device models as well as AI models, Spice equivalent-circuit models, and S-parameter models that are generated from SuperEM/UltraEM, EMCompiler can perform schematic-layout co-simulations.
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